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Telcordia Sr 332 Handbook __FULL__



Figure 1 shows an example using the MIL-HDBK-217 method (in ReliaSoftLambda Predict software) to predict the failure rate of a ceramic capacitor. According to the handbook, the failure rate of a commercial ceramic capacitor of 0.00068 μF capacitance with 80% operation voltage, working under 30 degrees ambient temperature and "ground benign" environment is 0.0217 / 106 hours. The corresponding MTBF (mean time before failure) or MTTF (mean time to failure) is estimated to be 4.6140 / 107 hours.




Telcordia Sr 332 Handbook



Bellcore was a telecommunications research and development company that provided joint R&D and standards setting for AT&T and its co-owners. Because of dissatisfaction with military handbook methods for their commercial products, Bellcore designed its own reliability prediction standard for commercial telecommunication products. In 1997, the company was acquired by Science Applications International Corporation (SAIC) and the company's name was changed to Telcordia. Telcordia continues to revise and update the standard. The latest two updates are SR-332 Issue 2 (September 2006) and SR-332 Issue 3 (January 2011), both called "Reliability Prediction Procedure for Electronic Equipment."


Beginning in 2008, DOD undertook a concerted effort to raise the priority of reliability through greater use of design for reliability techniques, reliability growth testing, and formal reliability growth modeling, by both the contractors and DOD units. To this end, handbooks, guidances, and formal memoranda were revised or newly issued to reduce the frequency of reliability deficiencies for defense systems in operational testing and the effects of those deficiencies. Reliability Growth evaluates these recent changes and, more generally, assesses how current DOD principles and practices could be modified to increase the likelihood that defense systems will satisfy their reliability requirements. This report examines changes to the reliability requirements for proposed systems; defines modern design and testing for reliability; discusses the contractor's role in reliability testing; and summarizes the current state of formal reliability growth modeling. The recommendations of Reliability Growth will improve the reliability of defense systems and protect the health of the valuable personnel who operate them.


Fortunately, there are a number of standardised approaches to calculating reliability, and software tools are also available to help. Among the most commonly used standards, or reliability handbooks, in the electronics industry are Telcordia SR-332 and MIL-HBK-217. Others include IEC TR 62380, which is based on French telecommunications standards, and the Chinese GJB handbooks.


By comparing predictions with accumulated field data, product manufacturers can apply the standard judiciously to ensure true-to-life reliability predictions for new products. CUI typically uses Telcordia SR-332 or MIL-HBK-217 handbooks to calculate MTBF for power supply products, including external power adapters and chassis-mount ac-dc power supplies.


RDF 2000 is a reliability data handbook developed by the French telecommunications industry. This standard provides reliability prediction models for a range of electronic components using cycling profiles and applicable phases as a basis for failure rate calculations 4. RDF 2000 provides a unique approach to handle mission profiles in the failure rate prediction. Component failure is defined in terms of an empirical expression containing a base failure rate that is multiplied by factors influenced by mission profiles. These mission profiles contain information about how the component failure rate may be affected by operational cycling, ambient temperature variation and/or equipment switch on/off temperature variations. RDF 2000 disregards the wearout period and the infant mortality stage of product life based on the assumption that, for most electronic components, the wearout period is never reached because new products will replace the old ones before the wearout occurs. For components whose wearout period is not very far in the future, the normal life period has to be determined. The infant mortality stage failure rate is caused by a wide range of factors, such as manufacturing processes and material weakness, but can be eliminated by improving the design and production processes (e.g. by performing burn-in).


RDF 2000 is a reliability data handbook developed by the French telecommunications industry. This standard provides reliability prediction models for a range of electronic components using cycling profiles and applicable phases as a basis for failure rate calculations [4]. RDF 2000 provides a unique approach to handle mission profiles in the failure rate prediction. Component failure is defined in terms of an empirical expression containing a base failure rate that is multiplied by factors influenced by mission profiles. These mission profiles contain information about how the component failure rate may be affected by operational cycling, ambient temperature variation and/or equipment switch on/off temperature variations. RDF 2000 disregards the wearout period and the infant mortality stage of product life based on the assumption that, for most electronic components, the wearout period is never reached because new products will replace the old ones before the wearout occurs. For components whose wearout period is not very far in the future, the normal life period has to be determined. The infant mortality stage failure rate is caused by a wide range of factors, such as manufacturing processes and material weakness, but can be eliminated by improving the design and production processes (e.g. by performing burn-in). 350c69d7ab


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